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dc.contributor.authorChenga, P. L.en_US
dc.contributor.authorLiao, C. I.en_US
dc.contributor.authorChien, C. C.en_US
dc.contributor.authorYang, C. L.en_US
dc.contributor.authorTing, S. F.en_US
dc.contributor.authorJeng, L. S.en_US
dc.contributor.authorHuang, C. T.en_US
dc.contributor.authorCheng, Osberten_US
dc.contributor.authorTzou, S. F.en_US
dc.contributor.authorHsu, W. S.en_US
dc.date.accessioned2014-12-08T15:12:35Z-
dc.date.available2014-12-08T15:12:35Z-
dc.date.issued2008-02-15en_US
dc.identifier.issn0254-0584en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.matchemphys.2007.08.020en_US
dc.identifier.urihttp://hdl.handle.net/11536/9675-
dc.description.abstractLocally strained Si technology using embedded SiGe has been used to improve pMOSFET device performance through hole mobility enhancement. Embedded SiGe is achieved by selectively growing epitaxial SiGe film in recessed Si pMOSFET source and drain areas. Prior to selective SiGe epi growth, a thin layer of Si seed was employed to help nucleate following low-temperature selective SiGe epitaxial film in recessed. source and drain areas. In combination with pre-epi wet clean and low-temperature chemical bake, use of Si seed resulted in improved SiGe film morphology and micro-loading effect, and further improved device performance. (c) 2007 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectepitaxial growthen_US
dc.subjectdislocationsen_US
dc.subjectsurfacesen_US
dc.subjectsemiconductorsen_US
dc.titleEffectiveness of Si thin buffer layer for selective SiGe epitaxial growth in recessed source and drain for pMOSen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.matchemphys.2007.08.020en_US
dc.identifier.journalMATERIALS CHEMISTRY AND PHYSICSen_US
dc.citation.volume107en_US
dc.citation.issue2-3en_US
dc.citation.spage471en_US
dc.citation.epage475en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000252580400049-
dc.citation.woscount1-
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