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dc.contributor.authorCheng, C. H.en_US
dc.contributor.authorPan, H. C.en_US
dc.contributor.authorLin, S. H.en_US
dc.contributor.authorHsu, H. H.en_US
dc.contributor.authorHsiao, C. N.en_US
dc.contributor.authorChou, C. P.en_US
dc.contributor.authorYeh, F. S.en_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:12:50Z-
dc.date.available2014-12-08T15:12:50Z-
dc.date.issued2008en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/9893-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2993977en_US
dc.description.abstractWe have fabricated high-kappa Ni/TiZrO/TaN metal-insulator-metal (MIM) capacitors. A low leakage current of 3.3x10(-8) A/cm(2) at -1 V was obtained for a 18 fF/mu m(2) capacitance density. For a 5.5 fF/mu m(2) capacitance density device, a small voltage coefficient of capacitance alpha of 105 ppm/V(2) and temperature coefficient of capacitance of 156 ppm/degrees C were measured. (c) 2008 The Electrochemical Society. [DOI: 10.1149/1.2993977] All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleHigh-Performance MIM Capacitors Using a High-kappa TiZrO Dielectricen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2993977en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume155en_US
dc.citation.issue12en_US
dc.citation.spageG295en_US
dc.citation.epageG298en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000260479700065-
dc.citation.woscount9-
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