1. 目前位置：

瀏覽 的方式： 作者 材料科學與工程學系

跳到： 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
或是輸入前幾個字：  
顯示 1962 到 1981 筆資料，總共 4818 筆 < 上一頁   下一頁 >
公開日期標題作者
2006The influences of contact interfaces between the indium tin oxide-based contact layer and GaN-based LEDsHsu, CY; Lan, WH; Wu, YCS; 材料科學與工程學系; Department of Materials Science and Engineering
2012The Influences of Oxygen Incorporation on the Defect Trap States of a-IGZO Thin-film TransistorsLo, Chun-Chieh; Hsieh, Tsung-Eong; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2013Influences of SiOx layer thickness on the characteristics of In-Zn-O/SiOx/n-Si hetero-junction structure solar cellsFang, Hau-Wei; Hsieh, Tsung-Eong; Juang, Jenh-Yih; 材料科學與工程學系; 電子物理學系; Department of Materials Science and Engineering; Department of Electrophysics
26-七月-2010The influences of surface treatment and gas annealing conditions on the inversion behaviors of the atomic-layer-deposition Al(2)O(3)/n-In(0.53)Ga(0.47)As metal-oxide-semiconductor capacitorTrinh, H. D.; Chang, E. Y.; Wu, P. W.; Wong, Y. Y.; Chang, C. T.; Hsieh, Y. F.; Yu, C. C.; Nguyen, H. Q.; Lin, Y. C.; Lin, K. L.; Hudait, M. K.; 材料科學與工程學系; Department of Materials Science and Engineering
26-七月-2010The influences of surface treatment and gas annealing conditions on the inversion behaviors of the atomic-layer-deposition Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitorTrinh, H. D.; Chang, E. Y.; Wu, P. W.; Wong, Y. Y.; Chang, C. T.; Hsieh, Y. F.; Yu, C. C.; Nguyen, H. Q.; Lin, Y. C.; Lin, K. L.; Hudait, M. K.; 材料科學與工程學系; Department of Materials Science and Engineering
15-七月-2007Influences of Ti, TiN, Ta and TaN layers on integration of low-k SiOC : H and CuTsai, Kou-Chiang; Wu, Wen-Fa; Chao, Chuen-Guang; Hsu, Jwo-Lun; Chiang, Chiu-Fen; 材料科學與工程學系; Department of Materials Science and Engineering
9-一月-2006Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigrationChiu, SH; Shao, TL; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2018InGaAs Junctionless FinFETs With Self-Aligned Ni-InGaAs S/DChang, Po-Chun; Hsiao, Chih-Jen; Lumbantoruan, Franky Juanda; Wu, Chia-Hsun; Lin, Yen-Ku; Lin, Yueh-Chin; Sze, Simon M.; Chang, Edward Yi; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-三月-2017InGaAs QW-MOSFET Performance Improvement Using a PEALD-AlN Passivation Layer and an In-Situ NH3 Post Remote-Plasma TreatmentChang, Po-Chun; Luc, Quang-Ho; Lin, Yueh-Chin; Lin, Yen-Ku; Wu, Chia-Hsun; Sze, Simon M.; Chang, Edward Yi; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2010InGaN-GaN Light Emitting Diode Performance Improved by Roughening Indium Tin Oxide Window Layer via Natural LithographyLiao, Cheng; Wu, YewChung Sermon; 材料科學與工程學系; Department of Materials Science and Engineering
1-八月-2012InGaP/GaAs Dual-Junction Solar Cell with AlGaAs/GaAs Tunnel Diode Grown on 10 degrees off Misoriented GaAs SubstrateYu, Hung Wei; Chung, Chen Chen; Wang, Chin Te; Hong Quan Nguyen; Binh Tinh Tran; Lin, Kung Liang; Dee, Chang Fu; Majlis, Burhanuddin Yeop; Chang, Edward Yi; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
10-六月-2004InGaP/InGaAs PHEMT with high IP3 for low noise applicationsLin, YC; Chang, EY; Chen, GJ; Lee, HM; Huang, GW; Biswas, D; Chang, CY; 材料科學與工程學系; 電子工程學系及電子研究所; 友訊交大聯合研發中心; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics; D Link NCTU Joint Res Ctr
1-十一月-2011Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on CuHsiao, H. -Y.; Hu, C. -C.; Guo, M. -Y.; Chen, C.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-1999Initialization characteristics and their effects on the erasability of phase change optical disks using transmission electron microscopyChen, HW; Hsieh, TE; Liu, JR; Shieh, HPD; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
28-二月-2016Injectable insulin-lysozyme-loaded nanogels with enzymatically-controlled degradation and release for basal insulin treatment: In vitro characterization and in vivo observationChou, Hao-Syun; Larsson, Mikael; Hsiao, Meng-Hsuan; Chen, Yi-Chieh; Roeding, Magnus; Nyden, Magnus; Liu, Dean-Mo; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2020An Inkjet Printing Technique for Scalable Microfabrication of Graphene-Based Sensor ComponentsFu, Yu-Min; Chou, Meng-Chuin; Kang, Che-Hao; Cheng, Yu-Ting; Wu, Pu-Wei; Chen, Guan-Yu; Secor, Ethan B.; Hersam, Mark C.; 材料科學與工程學系; 生醫工程研究所; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Institute of Biomedical Engineering; Department of Electronics Engineering and Institute of Electronics
1-十月-2011Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devicesLiu, Tao-Chi; Chen, Chih; Liu, Shih-Ting; Chang, Ming-Lun; Lin, Jandel; 材料科學與工程學系; Department of Materials Science and Engineering
7-十月-2019Insight into the Catalytic Effects of Open Metal Sites in Metal - Organic Frameworks on Hydride Dehydrogenation via NanoconfinementWu, Yi-Ju; Wang, Cheng-Yu; 材料科學與工程學系; Department of Materials Science and Engineering
20-八月-2017Insights into linear supramolecular polymer formation via TPE and BODIPY containing host-guest interactionGouda, Chinmayananda; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2020Instant Cu-to-Cu direct bonding enabled by < 111 >-oriented nanotwinned Cu bumpsShie, Kai Cheng; Juang, Jing-Ye; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1962 到 1981 筆資料，總共 4818 筆 < 上一頁   下一頁 >