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公開日期標題作者
1-一月-2017Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration ApplicationsHuang, Yen-Jun; Chen, Hsiu-Chi; Yu, Ting-Yang; Lai, Bo-Hung; Shih, Yu-Chiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2013Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Yu, Tsung-Han; Chiang, Cheng-Hao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2017Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous IntegrationYang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
三月-2017Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC ApplicationsCheng, Chuan-An; Tsai, Tsung-Yen; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Co-sputtered Cu/Ti Bonded Interconnects for 3D Integration ApplicationsChen, Hsiao-Yu; Hsu, Sheng-Yao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
29-八月-2014Conductivity enhancement of multiwalled carbon nanotube thin film via thermal compression methodTsai, Wan-Lin; Wang, Kuang-Yu; Chang, Yao-Jen; Li, Yu-Ren; Yang, Po-Yu; Chen, Kuan-Neng; Cheng, Huang-Chung; 交大名義發表; 電子工程學系及電子研究所; National Chiao Tung University; Department of Electronics Engineering and Institute of Electronics
1-七月-2012Cosputtered Cu/Ti Bonded Interconnects With a Self-Formed Adhesion Layer for Three-Dimensional Integration ApplicationsHsu, Sheng-Yao; Chen, Hsiao-Yu; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2011Demonstration and Electrical Performance Investigation of Wafer-Level Cu Oxide Hybrid Bonding SchemesChen, Kuan-Neng; Xu, Zheng; Lu, Jian-Qiang; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2015Demonstration and Electrical Performance of Cu-Cu Bonding at 150 degrees C With Pd PassivationHuang, Yan-Pin; Chien, Yu-San; Tzeng, Ruoh-Ning; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Development and Electrical Investigation of Novel Fine-Pitch Cu/Sn Pad Bumping Using Ultra-Thin Buffer Layer Technique in 3D IntegrationHsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電機學院; College of Electrical and Computer Engineering
1-一月-2017Development and Electrical Investigation of Through Glass Via and Through Si Via in 3D IntegrationChang, Geng-Ming; Lee, Shih-Wei; Chang, Ching-Yun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Development and Electrical Performance of Low Temperature Cu-Sn/In Bonding for 3D Flexible Substate IntegrationHu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2017Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration ApplicationsChen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-四月-2017Development of Bumpless Stacking With Bottom-Up TSV FabricationLee, Shih-Wei; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2015Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance ModificationShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-二月-2015A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applicationsChang, Chih-Wei; Chou, Lei-Chun; Huang, Po-Tsang; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chiou, Jin-Chern; 交大名義發表; National Chiao Tung University
1-十月-2012Effects of Bonding Technology and Thinning Process in Three-Dimensional Integration on Device CharacteristicsLu, Cheng-Hsien; Cheng, Chuan-An; Ho, Chia-Hua; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2013Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond SchemeChang, Yao-Jen; Ko, Cheng-Ta; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Electrical Investigation of Cu Pumping in Through-Silicon Vias for BEOL Reliability in 3D IntegrationCheng, Chuan-An; Sugie, Ryuichi; Uchida, Tomoyuki; Chen, Kou-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
顯示 21 到 40 筆資料，總共 164 筆 < 上一頁   下一頁 >