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公開日期標題作者
1996BESOI的製作林政男; Lin, Cheng-Nan; 蔡中, 荊鳳德; C. Tsai, Albert Chin; 電子研究所
1999Development of low-temperature wafer level vacuum packaging for microsensorsHuang, WF; Shie, JS; Lee, C; Gong, SC; Peng, CJ; 光電工程學系; Department of Photonics
2005Effect of different n-electrode patterns on optical characteristics of large-area p-side down InGaN light-emitting diodes fabricated by laser lift-offChu, JT; Liang, WD; Kao, CC; Huang, HW; Chu, CF; Kuo, HC; Wang, SC; 光電工程學系; Department of Photonics
1-十一月-2005Effects of different n-electrode patterns on optical characteristics of large-area p-side-down InGaN light-emitting diodes fabricated by laser lift-offChu, JT; Kao, CC; Huang, HW; Liang, WD; Chu, CF; Lu, TC; Kuo, HC; Wang, SC; 光電工程學系; Department of Photonics
1-四月-2005Fabrication of large-area GaN-based light-emitting diodes on Cu substrateChu, JT; Huang, HW; Kao, CC; Liang, WD; Lai, FI; Chu, CF; Kuo, HC; Wang, SC; 光電工程學系; Department of Photonics
1-五月-2008Further enhancement of nitride-based near-ultraviolet vertical-injection light-emitting diodes by adopting a roughened mesh-surfaceLee, Chia-En; Lee, Yea-Chen; Kuo, Hao-Chung; Lu, Tien-Chang; Wang, Shing-Chung; 光電工程學系; Department of Photonics
1-一月-2017High Transmittance and Broaden Bandwidth through the Morphology of Anti-Reflective Layers on THz Polarizer with Si SubstrateChi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; 奈米科學及工程學士學位學程; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics; Undergraduate Honors Program of Nano Science and Engineering
1-一月-2017High Transmittance Broadband THz Polarizer Using 3D-IC TechnologiesChi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Yang, Yu-Tao; Chen, Kuan-Neng; 電機學院; 電子工程學系及電子研究所; College of Electrical and Computer Engineering; Department of Electronics Engineering and Institute of Electronics
1-一月-2015High Transmittance Silicon Terahertz Polarizer Using Wafer Bonding TechnologyYu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-七月-2015Innovative Fabrication of Wafer-Level InGaN-Based Thin-Film Flip-Chip Light-Emitting DiodesChiang, Yen-Chih; Lin, Bing-Cheng; Chen, Kuo-Ju; Lin, Chien-Chung; Lee, Po-Tsung; Kuo, Hao-Chung; 光電系統研究所; 照明與能源光電研究所; 光電工程學系; Institute of Photonic System; Institute of Lighting and Energy Photonics; Department of Photonics
1-十二月-2010Investigation and Effects of Wafer Bow in 3D Integration Bonding SchemesChen, K. N.; Zhu, Y.; Wu, W. W.; Reif, R.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-三月-2009Nitride-Based Thin-Film Light-Emitting Diodes With Photonic Quasi-Crystal SurfaceLee, Chia-En; Lai, Chun-Feng; Lee, Yea-Chen; Kuo, Hao-Chung; Lu, Tien-Chang; Wang, Shing-Chung; 光電工程學系; Department of Photonics
2009N型砷化鎵/N型矽晶圓接合介面形態與電性研究張岱民; Chang, Tai-Min; 吳耀銓; Wu, Yew-Chung Sermon; 材料科學與工程學系
2009Output Power Enhancement of Vertical-Injection Ultraviolet Light-Emitting Diodes by GaN-Free and Surface Roughness StructuresLee, C. E.; Cheng, B. S.; Lee, Y. C.; Kuo, H. C.; Lu, T. C.; Wang, S. C.; 光電工程學系; Department of Photonics
2010Output Power of AlGaInP Light Emitting Diode Improved by Double Roughening AlGaInP SurfacesHuang, Ping-Wei; Wu, YewChung Sermon; 材料科學與工程學系; Department of Materials Science and Engineering
2004P型砷化鎵晶圓接合電性與界面形態之研究陳一凡; Yi-Fan Chen; 吳耀銓; Yew Chung Sermon Wu Ph. D.; 材料科學與工程學系
2013P型鍺與N型矽晶圓接合介面型態與電性研究林敬富; Lin, Ching-Fu; 吳耀銓; Wu, Yew-Chung; 材料科學與工程學系所
25-八月-2000Wafer bonding by low-temperature solderingLee, C; Huang, WF; Shie, JS; 光電工程學系; Department of Photonics
1-九月-2003Wafer bonding by Ni-induced crystallization of amorphous siliconChao, CP; Wu, YCS; Lee, TL; Wang, YH; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2005Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layersLiu, PC; Hou, CY; Wu, YCS; 材料科學與工程學系; Department of Materials Science and Engineering
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