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國立陽明交通大學機構典藏
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公開日期
標題
作者
2006
4-GHz fully monolithic SiGe HBT QVCO using superharmonic coupling topology
Tseng, S. C.
;
Meng, C. C.
;
Chang, Y. W.
;
Huang, G. W.
;
電信工程研究所
;
Institute of Communications Engineering
2006
4-GHz low-phase-noise transformer-based top-series GaInP/GaAs HBT QVCO
Meng, C. C.
;
Tseng, S. C.
;
Chang, Y. W.
;
Su, J. Y.
;
Huang, G. W.
;
電信工程研究所
;
Institute of Communications Engineering
21-六月-2007
9.5 GHz GaInP/GaAs HBT divide-by-two frequency divider using super-dynamic D-type flip-flop technique
Wei, H.-J.
;
Meng, C.
;
Chang, Y. W.
;
Huang, G.-W
;
電信工程研究所
;
Institute of Communications Engineering
1-一月-2013
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
Chang, Y. W.
;
Peng, H. Y.
;
Yang, R. W.
;
Chen, Chih
;
Chang, T. C.
;
Zhan, C. J.
;
Juang, J. Y.
;
Huang, Annie T.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-四月-2007
C-band fully integrated SiGe HBT superharmonic QVCO
Tseng, S. C.
;
Meng, C. C.
;
Chang, Y. W.
;
Huang, G. W.
;
電信工程研究所
;
Institute of Communications Engineering
2007
Characterization and Monte Carlo analysis of secondary electrons induced program disturb in a buried diffusion bit-line SONOS flash memory
Tang, Chun-Jung
;
Li, C. W.
;
Wang, Tahui
;
Gu, S. H.
;
Chen, P. C.
;
Chang, Y. W.
;
Lu, T. C.
;
Lu, W. P.
;
Chen, K. C.
;
Lu, Chih-Yuan
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-七月-2008
Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
Liang, S. W.
;
Chang, Y. W.
;
Chen, Chih
;
Preciado, Jackie
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
16-五月-2011
Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints
Chang, Y. W.
;
Chiu, S. H.
;
Chen, Chih
;
Yao, D. J.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
10-七月-2006
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
Liang, S. W.
;
Chang, Y. W.
;
Shao, T. L.
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
24-九月-2007
Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
Chang, Y. W.
;
Chiang, T. H.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
15-十二月-2014
Fast phase transformation due to electromigration of 18 mu m microbumps in three-dimensional integrated-circuit integration
Chang, Y. W.
;
Chen, Chih
;
Chang, T. C.
;
Zhan, C. J.
;
Juang, J. Y.
;
Huang, Annie T.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-八月-2006
Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results
Liang, S. W.
;
Chang, Y. W.
;
Chen, Chih
;
Liu, Y. C.
;
Chen, K. H.
;
Lin, S. H.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-一月-2019
Hot-Carrier Injection-Induced Disturb and Improvement Methods in 3D NAND Flash Memory
Lin, Wei-Liang
;
Tsai, Wen-Jer
;
Cheng, C. C.
;
Lu, Chun-Chang
;
Ku, S. H.
;
Chang, Y. W.
;
Wu, Guan-Wei
;
Liu, Lenvis
;
Hwang, S. W.
;
Lu, Tao-Cheng
;
Chen, Kuang-Chao
;
Tseng, Tseung-Yuen
;
Lu, Chih-Yuan
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-十一月-2010
Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints
Chang, Y. W.
;
Chiu, S. H.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-一月-2007
Low-phase-noise transformer-based top-series QVCO using GaInP/GaAs HBT technology
Meng, C. C.
;
Tseng, S. C.
;
Chang, Y. W.
;
Su, J. Y.
;
Huang, G. W.
;
電信工程研究所
;
Institute of Communications Engineering
2009
Optimal Design of Passivation/UBM Openings for Reducing Current Crowding Effect Under Electromigration of Flip-chip Solder Joint
Chang, Y. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
八月-2016
Poly-Silicon Trap Position and Pass Voltage Effects on RTN Amplitude in a Vertical NAND Flash Cell String
Chou, Y. L.
;
Wang, Tahui
;
Lin, Mercator
;
Chang, Y. W.
;
Liu, Lenvis
;
Huang, S. W.
;
Tsai, W. J.
;
Lu, T. C.
;
Chen, K. C.
;
Lu, Chih-Yuan
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-十月-2007
Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns
Liang, S. W.
;
Chang, Y. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
2007
Study of electromigration of flip-chip solder joints using Kelvin probes
Chang, Y. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
17-七月-2006
Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
Chang, Y. W.
;
Liang, S. W.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering