| 公開日期 | 標題 | 作者 |
| 1-一月-2014 | 2.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural-Sensing Applications | Huang, Po-Tsang; Chou, Lei-Chun; Huang, Teng-Chieh; Wu, Shang-Lin; Wang, Tang-Shuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chen, Kuan-Neng; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Cheng, Ming-Hsiang; Lin, Yueh-Lung; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University |
| 2013 | Area-Power-Efficient 11-Bit SAR ADC with Delay-Line Enhanced Tuning for Neural Sensing Applications | Huang, Teng-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-二月-2015 | A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications | Chang, Chih-Wei; Chou, Lei-Chun; Huang, Po-Tsang; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chiou, Jin-Chern; 交大名義發表; National Chiao Tung University |
| 1-一月-2014 | Energy-Efficient Configurable Discrete Wavelet Transform for Neural Sensing Applications | Wang, Tang-Hsuan; Huang, Po-Tsang; Chen, Kuan-Neng; Chiou, Jin-Chem; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei; 電機工程學系; Department of Electrical and Computer Engineering |
| 1-一月-2014 | Energy-Efficient Low-Noise 16-Channel Analog-Front-End Circuit for Bio-potential Acquisition | Wu, Shang-Lin; Huang, Po-Tsang; Huang, Teng-Chieh; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-一月-2014 | Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio- Signal Recording Application | Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Wu, Shang-Lin; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University |
| 2012 | Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration | Chiang, Cheng-Hao; Hu, Yu-Chen; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2012 | Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS Integrations | Hu, Yu-Chen; Chiang, Cheng-Hao; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2014 | Polymer TSV Fabrication Scheme with Its Electrical and Reliability Test Vehicle | Lee, Shih-Wei; Shih, Jian-Yu; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-七月-2017 | Polymer-Based Liner TSV Fabrication Scheme and Its Resistance Variation | Lee, Shih-Wei; Shih, Jian-Yu; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-一月-2013 | Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications | Chang, Chih-Wei; Huang, Po-Tsang; Chou, Lei-Chun; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Lee, Yen-Chi; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University |
| 1-二月-2014 | A TSV-Based Bio-Signal Package With mu-Probe Array | Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University |
| 1-一月-2014 | A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array | Chou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University |
