標題: | Polymer TSV Fabrication Scheme with Its Electrical and Reliability Test Vehicle |
作者: | Lee, Shih-Wei Shih, Jian-Yu Chuang, Ching-Te Hwang, Wei Chiou, Jin-Chern Chen, Kuo-Hua Chiu, Chi-Tsung Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 2014 |
摘要: | In this research, a novel process scheme for polymer TSV fabrication is proposed to solve the difficulty of polymer liner formation in TSV technology. The corresponding structure shows great manufacturability to replace traditional fabrication approach. In addition, Kelvin structure of the daisy chain is designed for evaluating electrical performance and reliability. Moreover, daisy chain with dummy TSV is designed to verify the impact of TSV pitch on TSV fabrication by using electrical measurement. The reliability tests include thermal cycling and humidity test to verify the quality of proposed polymer TSV design. Finally, a void-free polymer TSV with uniform liner formation is successfully fabricated and demonstrated. |
URI: | http://hdl.handle.net/11536/136337 |
ISBN: | 978-1-4799-7727-7 |
期刊: | 2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) |
起始頁: | 282 |
結束頁: | 285 |
顯示於類別: | 會議論文 |