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公開日期標題作者
2009Bianchi Type I 空間宇宙模型的動態系統解析邱韋嵐; Chiu, Wei-Lan; 高文芳; Kao, Wen-Fang; 物理研究所
2015Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packagingChiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
28-四月-2014Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallizationChiu, Wei-Lan; Liu, Chien-Min; Haung, Yi-Sa; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2016Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structuresChiu, Wei-Lan; Liu, Chien-Min; Haung, Yi-Sa; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
15-十月-2014Grain growth in electroplated (111)-oriented nanotwinned CuHuang, Yi-Sa; Liu, Chien-Min; Chiu, Wei-Lan; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2015三維積體電路晶片間接點之研究: Cu3Sn接點與金對金直接接合邱韋嵐; 陳智; Chiu, Wei-Lan; Chen, Chih; 材料科學與工程學系所
顯示 1 到 6 筆資料，總共 6 筆