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公開日期標題作者
1-五月-2006Aging influence of poly(ethylene glycol) suppressors of Cu electrolytes on gaps fillingLiu, SH; Li, TC; Chen, C; Shieh, JM; Dai, BT; Hensen, K; Cheng, SS; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-1996Antenna charging effects on the electrical characteristics of polysilicon gate during electron cyclotron resonance etchingKang, TK; Ueng, SY; Dai, BT; Chen, LP; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-十一月-2003The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layerChiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2001Characteristics of fluorinated amorphous carbon films and implementation of 0.15 mu m Cu/a-C : F damascene interconnectionShieh, JM; Suen, SC; Tsai, KC; Dai, BT; Wu, YC; Wu, YH; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2000Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitorChiu, SY; Shieh, JM; Chang, SC; Lin, KC; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-1997Charging damages to gate oxides in a helicon O-2 plasmaLin, W; Kang, TK; Perng, YC; Dai, BT; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-1997Charging damages to gate oxides in a helicon O-2 plasmaLin, W; Kang, TK; Perng, YC; Dai, BT; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-1995Chemical mechanical polishing of PSG and BPSG dielectric films: The effect of phosphorus and boron concentrationLiu, CW; Dai, BT; Yeh, CF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
27-三月-2006Dopant profile engineering by near-infrared femtosecond laser activationWang, YC; Pan, CL; Shieh, JM; Dai, BT; 光電工程學系; Department of Photonics
1-九月-2002The effect of plating current densities on self-annealing Behaviors of electroplated copper filmsChang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering
2006Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishingFang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-1998Effects of helicon-wave-plasma etching on the charging damage of aluminum interconnectsLin, W; Kang, TK; Perng, YC; Dai, BT; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-十二月-1996Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin filmsTseng, WT; Liu, CW; Dai, BT; Yeh, CF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2002Electrochemical behavior of copper chemical mechanical polishing in KIO3 slurryHsu, JW; Chiu, SY; Tsai, MS; Dai, BT; Feng, MS; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2002Electroplating copper in sub-100 nm gaps by additives with low consumption and diffusion abilityLin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
2005Emission of bright blue light from mesoporous silica with dense Si (Ge) nanocrystalsCho, AT; Shieh, JM; Shieh, J; Lai, YF; Dai, BT; Pan, FM; Kuo, HC; Lin, YC; Chao, KJ; Liu, PH; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
1999Evaluation of impurity migration and microwave digestion methods for lithographic materialsKo, FH; Hsiao, LT; Chou, CT; Wang, MY; Wang, TK; Sun, YC; Cheng, BJ; Yeng, S; Dai, BT; 奈米中心; Nano Facility Center
1-三月-1996Fabrication of thin film transistors by chemical mechanical polished polycrystalline silicon filmsChang, CY; Lin, HY; Lei, TF; Cheng, JY; Chen, LP; Dai, BT; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2000Film characterization and evaluation of process performance for the modified electron beam resistKo, FH; Ting, JH; Chou, CT; Hsiao, LT; Huang, TY; Dai, BT; 奈米中心; Nano Facility Center
1-三月-2003Improving the quality of electroplated copper films by rapid thermal annealingChang, SC; Shieh, JM; Dai, BT; Feng, MS; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
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