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顯示 1 到 14 筆資料，總共 14 筆
公開日期標題作者
1-八月-2008Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopyHsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng; 材料科學與工程學系; Department of Materials Science and Engineering
11-六月-2007Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]Hsiao, Hsiang-Yao; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2014Extremely anisotropic single-crystal growth in nanotwinned copperLu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2012Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc ElectrodepositionLiu, Tao-Chi; Liu, Chien-Min; Hsiao, Hsiang-Yao; Lu, Jia-Ling; Huang, Yi-Sa; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2015Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packagingChiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2008Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared MicroscopyHsiao, Hsiang-Yao; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2008Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared MicroscopyHsiao, Hsiang-Yao; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2009Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder JointsLiang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
9-四月-2007Thermomigration in flip-chip SnPb solder joints under alternating current stressingHsiao, Hsiang-Yao; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2-三月-2009Thermomigration in Pb-free SnAg solder joint under alternating current stressingHsiao, Hsiang-Yao; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2012Thermomigration in solder jointsChen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-一月-2013Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropyTu, K. N.; Hsiao, Hsiang-Yao; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
25-五月-2012Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned CopperHsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2009覆晶銲錫接點在通電下焦耳熱效應及熱遷移之研究蕭翔耀; Hsiao, Hsiang-Yao; 陳智; Chen, Chih; 材料科學與工程學系
顯示 1 到 14 筆資料，總共 14 筆