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公開日期標題作者
1-四月-2017Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current StressingChen, Ming-Yao; Lin, Han-wen; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2009Effects of electromigration on grain rotation behavior of SnAg soldersLin, Han-wen; Chen, Chih; Kuo, J. C.; Chen, C. C.; 材料科學與工程學系; Department of Materials Science and Engineering
2016Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devicesChen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2015Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfacesTseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-八月-2013Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned CuLin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2012The preferential growth of eta-Cu6Sn5 on (111) uni-directional Cu padsLin, Han-wen; Lu, Jia-ling; Liu, Chen-min; Chen, Chih; Tu, King-ning; Chen, Delphic; Kuo, Jui-Chao; 材料科學與工程學系; Department of Materials Science and Engineering
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