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顯示 1 到 8 筆資料，總共 8 筆
公開日期標題作者
1-六月-2017A 3T1R Nonvolatile TCAM Using MLC ReRAM for Frequent-Off Instant-On Filters in IoT and Big-Data ProcessingChang, Meng-Fan; Lin, Chien-Chen; Lee, Albert; Chiang, Yen-Ning; Kuo, Chia-Chen; Yang, Geng-Hau; Tsai, Hsiang-Jen; Chen, Tien-Fu; Sheu, Shyh-Shyuan; 交大名義發表; 資訊工程學系; National Chiao Tung University; Department of Computer Science
1-一月-2015A 3T1R Nonvolatile TCAM Using MLC ReRAM with Sub-1ns Search TimeChang, Meng-Fan; Lin, Chien-Chen; Lee, Albert; Kuo, Chia-Chen; Yang, Geng-Hau; Tsai, Hsiang-Jen; Chen, Tien-Fu; Sheu, Shyh-Shyuan; Tseng, Pei-Ling; Lee, Heng-Yuan; Ku, Tzu-Kun; 交大名義發表; National Chiao Tung University
1-一月-2019A Comprehensive Modeling Framework for Ferroelectric Tunnel JunctionsHuang, Hsin-Hui; Wu, Tzu-Yun; Chu, Yueh-Hua; Wu, Ming-Hung; Hsu, Chien-Hua; Lee, Heng-Yuan; Sheu, Shyh-Shyuan; Lo, Wei-Chung; Hou, Tuo-Hung; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2019Extremely Compact Integrate-and-Fire STT-MRAM Neuron: A Pathway toward All-Spin Artificial Deep Neural NetworkWu, Ming-Hung; Hong, Ming-Chun; Chang, Chih-Cheng; Sahu, Paritosh; Wei, Jeng-Hua; Lee, Heng-Yuan; Sheu, Shyh-Shyuan; Hou, Tuo-Hung; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2019NV-BNN: An Accurate Deep Convolutional Neural Network Based on Binary STT-MRAM for Adaptive AI EdgeChang, Chih-Chcng; Wu, Ming-Hung; Lin, Jia-Wei; Li, Chun-Hsien; Parmar, Vivek; Lee, Heng-Yuan; Wei, Jeng-Hua; Sheu, Shyh-Shyuan; Suri, Manan; Chang, Tian-Sheuan; Hou, Tuo-Hung; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
十一月-2016A ReRAM-Based 4T2R Nonvolatile TCAM Using RC-Filtered Stress-Decoupled Scheme for Frequent-OFF Instant-ON Search Engines Used in IoT and Big-Data ProcessingChang, Meng-Fan; Huang, Lie-Yue; Lin, Wen-Zhang; Chiang, Yen-Ning; Kuo, Chia-Chen; Chuang, Ching-Hao; Yang, Keng-Hao; Tsai, Hsiang-Jen; Chen, Tien-Fu; Sheu, Shyh-Shyuan; 交大名義發表; National Chiao Tung University
1-一月-2019Sub-nA Low-Current HZO Ferroelectric Tunnel Junction for High-Performance and Accurate Deep Learning AccelerationWu, Tzu-Yun; Huang, Hsin-Hui; Chu, Yueh-Hua; Chang, Chih-Cheng; Wu, Ming -Hung; Hsu, Chien-Hua; Wu, Chien -Ting; Wu, Min-Ci; Wu, Wen-Wei; Chang, Tian-Sheuan; Lee, Heng-Yuan; Sheu, Shyh-Shyuan; Lot, Wei-Chung; Hou, Tuo-Hung; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-六月-2012A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory ApplicationKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
顯示 1 到 8 筆資料，總共 8 筆