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Showing results 1 to 20 of 20
Issue DateTitleAuthor(s)
20-Dec-2017Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void FormationChang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2013Eliminate Kirkendall voids in solder reactions on nanotwinned copperLiu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2014Extremely anisotropic single-crystal growth in nanotwinned copperLu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
2015Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packagingChiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
22-Sep-2008Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder jointsChen, Hsiao-Yun; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2016Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder JointsLin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
20-Jan-2011Heterogeneous and Homogeneous Nucleation of Epitaxial NiSi(2) in [110] Si NanowiresChou, Yi-Chia; Wu, Wen-Wei; Lee, Chung-Yang; Liu, Chun-Yi; Chen, Lih-Juann; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
20-Jan-2011Heterogeneous and Homogeneous Nucleation of Epitaxial NiSi2 in [110] Si NanowiresChou, Yi-Chia; Wu, Wen-Wei; Lee, Chung-Yang; Liu, Chun-Yi; Chen, Lih-Juann; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jun-2009Homogeneous Nucleation of Epitaxial CoSi(2) and NiSi in Si NanowiresChou, Yi-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jun-2009Homogeneous Nucleation of Epitaxial CoSi2 and NiSi in Si NanowiresChou, Yi-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
28-Sep-2017Intermetallic compounds in 3D integrated circuits technology: a brief reviewAnnuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2017Low temperature Cu-Cu direct bonding by (111) oriented nano-twin CuJuang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
12-May-2015Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned CuLiu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Mar-2015Materials challenges in three-dimensional integrated circuitsChen, Kuan-Neng; Tu, King-Ning; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Optimization of the nanotwin-induced zigzag surface of copper by electromigrationChen, Hsin-Ping; Huang, Chun-Wei; Wang, Chun-Wen; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
9-Feb-2006Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder jointsChen, Chih; Yeh, Everett Chang-Ching; Tu, King-Ning
1-Jan-2016Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element ModelingChang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
15-Sep-2016Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modelingChang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2020Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned CopperLi, Yu-Jin; Tu, King-Ning; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology
2-Mar-2020Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain StructuresLi, Yu-Jin; Tu, King-Ning; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology
Showing results 1 to 20 of 20