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公開日期標題作者
1-一月-2001Barrier capability of TaNx films deposited by different nitrogen flow rate against Cu diffusion in Cu/TaNx/n(+)-p junction diodesYang, WL; Wu, WF; Liu, DG; Wu, CC; Ou, KL; 機械工程學系; Department of Mechanical Engineering
1-十二月-2005Carbon nanotubes grown using cobalt silicide as catalyst and hydrogen pretreatmentWen, HC; Yang, KH; Ou, KL; Wu, WF; Luo, RC; Chou, CP; 機械工程學系; Department of Mechanical Engineering
31-十月-1997Characterization of TiN film grown by low-pressure-chemical-vapor-depositionMei, YJ; Chang, TC; Hu, JC; Chen, LJ; Yang, YL; Pan, FM; Wu, WF; Ting, A; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
20-四月-1997Deposition of indium tin oxide films on polycarbonate substrates by radio-frequency magnetron sputteringWu, WF; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
20-四月-1997Deposition of indium tin oxide films on polycarbonate substrates by radio-frequency magnetron sputteringWu, WF; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-2000Effect of aluminum seed layer on the crystallographic texture and electromigration resistance of physical vapor deposited copper interconnectChin, YL; Chiou, BS; Wu, WF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-二月-1996Effect of oxygen concentration in the sputtering ambient on the microstructure, electrical and optical properties of radio-frequency magnetron-sputtered indium tin oxide filmsWu, WF; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-五月-2002Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor-deposited copper interconnectChin, YL; Chiou, BS; Wu, WF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2002Effective repair to ultra-low-k dielectric material (k-2.0) by hexamethyidisilazane treatmentMor, YS; Chang, TC; Liu, PT; Tsai, TM; Chen, CW; Yan, ST; Chu, CJ; Wu, WF; Pan, FM; Lur, W; Sze, SM; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
24-二月-2006Effects of ammonia plasma treatment on the surface characteristics of carbon fibersWen, HC; Yang, K; Ou, KL; Wu, WF; Chou, CP; Luo, RC; Chang, YM; 機械工程學系; Department of Mechanical Engineering
1-二月-2003Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallizationWu, WF; Ou, KL; Chou, CP; Wu, CC; 機械工程學系; Department of Mechanical Engineering
1-七月-2004Electromigration and integration aspects for the copper-SiLK systemTseng, HS; Chiou, BS; Wu, WF; Ho, CC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2002Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatmentChang, TC; Liu, PT; Mor, YS; Tsai, TM; Chen, CW; Mei, YJ; Pan, FM; Wu, WF; Sze, SM; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2006High-reliability Ta2O5 metal-insulator-metal capacitors with Cu-based electrodesTsai, KC; Wu, WF; Chao, CG; Kuan, CP; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-1999Highly (111) textured titanium nitride layers for sub- quarter-micrometer Al metallizationWu, WF; Lin, CC; Huang, CC; Lin, HC; Chang, TC; Yang, RP; Huang, TY; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-九月-2002Improved TaN barrier layer against Cu diffusion by formation of an amorphous layer using plasma treatmentOu, KL; Wu, WF; Chou, CP; Chiou, SY; Wu, CC; 機械工程學系; Department of Mechanical Engineering
1-十一月-2002Improving the electrical integrity of Cu-CoSi2 contacted n(+)p junction diodes using nitrogen-incorporated Ta films as a diffusion barrierYang, WL; Wu, WF; You, HC; Ou, KL; Lei, TF; Chou, CP; 機械工程學系; 電子物理學系; Department of Mechanical Engineering; Department of Electrophysics
1-五月-2004Influence of N2O plasma treatment on microstructure and thermal stability of WNx barriers for Cu interconnectionTsai, KC; Wu, WF; Chen, JC; Pan, TJ; Chao, CG; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-1997Mechanical and optical properties of ITO films with anti-reflective and anti-wear coatingsWu, WF; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2005Novel multilayered Ti/TiN diffusion barrier for Al metallizationWu, WF; Tsai, KC; Chao, CG; Chen, JC; Ou, KL; 材料科學與工程學系; Department of Materials Science and Engineering
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