針對3D整合之電子設計自動化技術開發---總計畫(II)

Full metadata record

DC Field	Value	Language
dc.contributor.author	陳宏明	en_US
dc.contributor.author	Chen Hung-Ming	en_US
dc.date.accessioned	2014-12-13T10:45:01Z	-
dc.date.available	2014-12-13T10:45:01Z	-
dc.date.issued	2010	en_US
dc.identifier.govdoc	NSC99-2220-E009-034	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/100241	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2158177&docId=347294	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	3D整合	zh_TW
dc.subject	電子設計自動化	zh_TW
dc.subject	超越摩爾定律	zh_TW
dc.subject	矽穿孔	zh_TW
dc.subject	3D Integration	en_US
dc.subject	Electronic Design Automation	en_US
dc.subject	Beyond Moore‘s Law	en_US
dc.subject	TSV	en_US
dc.title	針對3D整合之電子設計自動化技術開發---總計畫(II)	zh_TW
dc.title	Electronic Design Automation for 3D Integration (II)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電子工程學系及電子研究所	zh_TW
Appears in Collections:	Research Plans

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