Title: | 針對3D整合之電子設計自動化技術開發---總計畫(II) Electronic Design Automation for 3D Integration (II) |
Authors: | 陳宏明 Chen Hung-Ming 國立交通大學電子工程學系及電子研究所 |
Keywords: | 3D整合;電子設計自動化;超越摩爾定律;矽穿孔;3D Integration;Electronic Design Automation;Beyond Moore‘s Law;TSV |
Issue Date: | 2010 |
Gov't Doc #: | NSC99-2220-E009-034 |
URI: | http://hdl.handle.net/11536/100241 https://www.grb.gov.tw/search/planDetail?id=2158177&docId=347294 |
Appears in Collections: | Research Plans |
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