針對3D整合之電子設計自動化技術開發---總計畫(II)

Title:	針對3D整合之電子設計自動化技術開發---總計畫(II) Electronic Design Automation for 3D Integration (II)
Authors:	陳宏明 Chen Hung-Ming 國立交通大學電子工程學系及電子研究所
Keywords:	3D整合;電子設計自動化;超越摩爾定律;矽穿孔;3D Integration;Electronic Design Automation;Beyond Moore‘s Law;TSV
Issue Date:	2010
Gov't Doc #:	NSC99-2220-E009-034
URI:	http://hdl.handle.net/11536/100241 https://www.grb.gov.tw/search/planDetail?id=2158177&docId=347294
Appears in Collections:	Research Plans

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