標題: 12吋矽晶圓半導體CVD製程設備及BST介電薄膜成長研究---子計畫二:BST 介電薄膜在12吋矽晶圓上快速熱回火製程中熱物理性質及熱應力之研究(II)
Study on the Thermal Properties and Stresses of a 12-inches Silicon Wafer with High-dielectric BST Thin Films in Rapid Thermal Processing/Annealing(II)
作者: 曲新生
CHU, HSIN-SEN
國立交通大學機械工程研究所
公開日期: 2000
官方說明文件#: NSC89-2212-E009-080
URI: http://hdl.handle.net/11536/102980
https://www.grb.gov.tw/search/planDetail?id=549699&docId=101498
Appears in Collections:Research Plans


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