Method of semiconductor manufacturing process

Full metadata record

DC Field	Value	Language
dc.contributor.author	Wu YewChung Sermon	en_US
dc.contributor.author	Wang Bau-Ming	en_US
dc.contributor.author	Hsiao Feng-Ching	en_US
dc.date.accessioned	2014-12-16T06:13:47Z	-
dc.date.available	2014-12-16T06:13:47Z	-
dc.date.issued	2014-12-09	en_US
dc.identifier.govdoc	H01L021/30	zh_TW
dc.identifier.govdoc	H01L021/46	zh_TW
dc.identifier.govdoc	H01L021/02	zh_TW
dc.identifier.govdoc	H01L021/18	zh_TW
dc.identifier.govdoc	H01L033/00	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/104323	-
dc.description.abstract	The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming a semiconductor substrate on the growing substrate; forming a first structure with plural grooves and between the growing substrate and the semiconductor substrate; and changing the temperature of the growing substrate and the semiconductor substrate.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Method of semiconductor manufacturing process	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	08906778	zh_TW
Appears in Collections:	Patents

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.