標題: | METHOD OF SEMICONDUCTOR MANUFACTURING PROCESS |
作者: | Wu YewChung Sermon Wang Bau-Ming Hsiao Feng-Ching |
公開日期: | 13-Sep-2012 |
摘要: | The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming a semiconductor substrate on the growing substrate; forming a first structure with plural grooves and between the growing substrate and the semiconductor substrate; and changing the temperature of the growing substrate and the semiconductor substrate. |
官方說明文件#: | H01L021/20 H01L021/26 |
URI: | http://hdl.handle.net/11536/105133 |
專利國: | USA |
專利號碼: | 20120231614 |
Appears in Collections: | Patents |
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