標題: | Method of semiconductor manufacturing process |
作者: | Wu YewChung Sermon Wang Bau-Ming Hsiao Feng-Ching |
公開日期: | 9-十二月-2014 |
摘要: | The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming a semiconductor substrate on the growing substrate; forming a first structure with plural grooves and between the growing substrate and the semiconductor substrate; and changing the temperature of the growing substrate and the semiconductor substrate. |
官方說明文件#: | H01L021/30 H01L021/46 H01L021/02 H01L021/18 H01L033/00 |
URI: | http://hdl.handle.net/11536/104323 |
專利國: | USA |
專利號碼: | 08906778 |
顯示於類別: | 專利資料 |