標題: METHOD FOR FABRICATING MICRONEEDLE ARRAY AND METHOD FOR FABRICATING EMBOSSING MOLD OF MICRONEEDLE ARRAY
作者: CHIOU, Jin-Chern
HUNG, Chen-Chun
CHANG, Chih-Wei
公開日期: 3-Jul-2008
摘要: The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.
官方說明文件#: B29C033/40
URI: http://hdl.handle.net/11536/105589
專利國: USA
專利號碼: 20080157427
Appears in Collections:Patents


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