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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorChen, Shih-Hungen_US
dc.date.accessioned2014-12-08T15:14:09Z-
dc.date.available2014-12-08T15:14:09Z-
dc.date.issued2007-05-01en_US
dc.identifier.issn0018-9200en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JSSC.2007.894823en_US
dc.identifier.urihttp://hdl.handle.net/11536/10840-
dc.description.abstractIn order to enhance the applications of SCR devices for deep-submicron CMOS technology, a novel SCR design with "initial-on" function is proposed to achieve the lowest trigger voltage and the highest turn-on efficiency of SCR device for effective on-chip ESD protection. Without using the special native device (NMOS with almost zero or even negative threshold voltage) or any process modification, this initial-on SCR design is implemented by PMOS-triggered SCR device, which can be realized in general CMOS processes. This initial-on SCR design has a high enough holding voltage to avoid latchup issues in a VDD operation voltage of 2.5 V. The new proposed initial-on ESD protection design with PMOS-triggered SCR device has been successfully verified in a fully-silicided 0.25-mu m CMOS process.en_US
dc.language.isoen_USen_US
dc.subjectelectrostatic discharges (ESD)en_US
dc.subjectsilicon controlled rectifier (SCR)en_US
dc.subjectturn-on efficiencyen_US
dc.subjectholding voltageen_US
dc.titleImplementation of initial-on ESD protection concept with PMOS-triggered SCR devices in deep-submicron CMOS technologyen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JSSC.2007.894823en_US
dc.identifier.journalIEEE JOURNAL OF SOLID-STATE CIRCUITSen_US
dc.citation.volume42en_US
dc.citation.issue5en_US
dc.citation.spage1158en_US
dc.citation.epage1168en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000246035000020-
dc.citation.woscount10-
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