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dc.contributor.authorHsu, Sheng-Fuen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2014-12-08T15:14:26Z-
dc.date.available2014-12-08T15:14:26Z-
dc.date.issued2007-04-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2007.892013en_US
dc.identifier.urihttp://hdl.handle.net/11536/10990-
dc.description.abstractThe dependence of device structures on latchup immunity in a 0.25-mu m high-voltage (HV) 40-V CMOS process with drain-extended MOS (DEMOS) transistors has been verified with silicon test chips and investigated with device simulation. Layout parameters such as anode-to-cathode spacing and guard ring width are also investigated to find their impacts on latchup immunity. It was demonstrated that the drain-extended NMOS with a specific isolated device structure can greatly enhance the latchup immunity. The proposed test structures and simulation methodologies can be applied to extract safe and compact design rule for latchup prevention of DEMOS transistors in HV CMOS process.en_US
dc.language.isoen_USen_US
dc.subjectdrain-extended MOS (DEMOS)en_US
dc.subjecthigh-voltage (HV) CMOS processen_US
dc.subjectlatchupen_US
dc.subjectsilicon-controlled rectifier (SCR)en_US
dc.subjecttransmission line pulsing (TLP)en_US
dc.titleDependence of device structures on latchup immunity in a high-voltage 40-V CMOS process with drain-extended MOSFETsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2007.892013en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume54en_US
dc.citation.issue4en_US
dc.citation.spage840en_US
dc.citation.epage851en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000245327900028-
dc.citation.woscount7-
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