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dc.contributor.authorChou, Hung-Muen_US
dc.contributor.authorLee, Jam-Wenen_US
dc.contributor.authorLi, Yimingen_US
dc.date.accessioned2014-12-08T15:14:47Z-
dc.date.available2014-12-08T15:14:47Z-
dc.date.issued2007-02-01en_US
dc.identifier.issn0167-9260en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.vlsi.2006.02.005en_US
dc.identifier.urihttp://hdl.handle.net/11536/11164-
dc.description.abstractIn this paper, a circuit design method for electrostatic discharge (ESD) protection is presented. It considers the gate floating state for ESD protection and negatively gate biased for leakage suppression under normal operations. The circuit is achieved by adding a switch device and a negatively biased circuit at the gate of ESD protection devices. Robustness and leakage of ESD protection circuit are improved. The circuit suits thin thickness of gate oxide of complementary metal oxide semiconductor (CMOS) devices due to an elimination of oxide damage. This approach benefits design of very large-scaled integration circuit and implementation of system-on-chip with sub-100 nm CMOS devices. (c) 2006 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectelectrostatic dischargeen_US
dc.subjectrobustnessen_US
dc.subjectfloating gateen_US
dc.subjectgate groundeden_US
dc.subjectleakage currenten_US
dc.subjectnegatively biased circuiten_US
dc.subjectsub-100 nm CMOS device and circuiten_US
dc.titleA floating gate design for electrostatic discharge protection circuitsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.vlsi.2006.02.005en_US
dc.identifier.journalINTEGRATION-THE VLSI JOURNALen_US
dc.citation.volume40en_US
dc.citation.issue2en_US
dc.citation.spage161en_US
dc.citation.epage166en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.department友訊交大聯合研發中心zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.contributor.departmentD Link NCTU Joint Res Ctren_US
dc.identifier.wosnumberWOS:000243627000009-
dc.citation.woscount1-
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