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dc.contributor.authorKao, Chyuan Hauren_US
dc.contributor.authorLai, Chao Sungen_US
dc.contributor.authorLee, Chung Lenen_US
dc.date.accessioned2014-12-08T15:15:10Z-
dc.date.available2014-12-08T15:15:10Z-
dc.date.issued2007en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/11403-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2433471en_US
dc.description.abstractWe show that the incorporation of fluorine into the oxide grown on polysilicon (polyoxide) not only improves the electrical characteristics (i.e., lower leakage current, higher electrical breakdown field), but also improves the reliability (lower electron trapping rate, larger Q(bd)). This improvement is believed to be due to the stress relaxation of the polyoxide and smoother polysilicon/polyoxide interface by the fluorine incorporation. The optimum fluorine dose (2x10(14)) shows the best characteristics such as E-bd over 12 MV/cm and Q(bd)similar to 2 C/cm(2). However, excessive fluorination (1x10(15)) seems to result in performance degradation due to the generation of nonbridging oxygen centers. (c) 2007 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleElectrical and reliability improvement in polyoxide by fluorine implantationen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2433471en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume154en_US
dc.citation.issue4en_US
dc.citation.spageH259en_US
dc.citation.epageH262en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000244792200057-
dc.citation.woscount2-
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