三維積體電路之頻率振盪元件封裝特性與應用

標題:	三維積體電路之頻率振盪元件封裝特性與應用 Study on Characteristics and Applications of Frequency Resonator Devices with 3D IC Integration
作者:	施建宇 Shih, Jian-Yu 陳冠能 Chen, Kuan-Neng 電子工程學系電子研究所
關鍵字:	三維積體電路技術;矽直銅導孔;晶圓級接合;晶圓薄化技術;石英頻率元件;3D integration;Cu through-silicon-vias;Wafer level bonding;wafer thinning techniques;quartz resonator device
公開日期:	2015
URI:	http://140.113.39.130/cdrfb3/record/nctu/#GT079811540 http://hdl.handle.net/11536/125934
Appears in Collections:	Thesis