1. You are Here：

Full metadata record
DC FieldValueLanguage
dc.contributor.authorChiu, SHen_US
dc.contributor.authorShao, TLen_US
dc.contributor.authorChen, Cen_US
dc.contributor.authorYao, DJen_US
dc.contributor.authorHsu, CYen_US
dc.date.accessioned2014-12-08T15:17:34Z-
dc.date.available2014-12-08T15:17:34Z-
dc.date.issued2006-01-09en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2151255en_US
dc.identifier.urihttp://hdl.handle.net/11536/12744-
dc.description.abstractJoule heating effect in solder joints was investigated using thermal infrared microscopy and modeling in this study. With the increase of applied current, the temperature increased rapidly due to Joule heating. Furthermore, modeling results indicated that a hot spot existed in the solder near the entrance point of the Al trace, and it became more pronounced as the applied current increased. The temperature difference between the hot spot and the solder was as large as 9.4 degrees C when the solder joint was powered by 0.8 A. This hot spot may play an important role in the initial void formation during electromigration.en_US
dc.language.isoen_USen_US
dc.titleInfrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigrationen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2151255en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume88en_US
dc.citation.issue2en_US
dc.citation.epageen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000234606900036-
dc.citation.woscount52-
Appears in Collections:Articles


Files in This Item:

  1. 000234606900036.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.

Related Contents
Loading...