Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration

doi:10.1063/1.2151255

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chiu, SH	en_US
dc.contributor.author	Shao, TL	en_US
dc.contributor.author	Chen, C	en_US
dc.contributor.author	Yao, DJ	en_US
dc.contributor.author	Hsu, CY	en_US
dc.date.accessioned	2014-12-08T15:17:34Z	-
dc.date.available	2014-12-08T15:17:34Z	-
dc.date.issued	2006-01-09	en_US
dc.identifier.issn	0003-6951	en_US
dc.identifier.uri	http://dx.doi.org/10.1063/1.2151255	en_US
dc.identifier.uri	http://hdl.handle.net/11536/12744	-
dc.description.abstract	Joule heating effect in solder joints was investigated using thermal infrared microscopy and modeling in this study. With the increase of applied current, the temperature increased rapidly due to Joule heating. Furthermore, modeling results indicated that a hot spot existed in the solder near the entrance point of the Al trace, and it became more pronounced as the applied current increased. The temperature difference between the hot spot and the solder was as large as 9.4 degrees C when the solder joint was powered by 0.8 A. This hot spot may play an important role in the initial void formation during electromigration.	en_US
dc.language.iso	en_US	en_US
dc.title	Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1063/1.2151255	en_US
dc.identifier.journal	APPLIED PHYSICS LETTERS	en_US
dc.citation.volume	88	en_US
dc.citation.issue	2	en_US
dc.citation.epage		en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000234606900036	-
dc.citation.woscount	52	-
顯示於類別：	期刊論文

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