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dc.contributor.author譚盎南en_US
dc.contributor.author陳宏明en_US
dc.contributor.author陳冠能en_US
dc.date.accessioned2015-12-04T07:03:35Z-
dc.date.available2015-12-04T07:03:35Z-
dc.date.issued2015-11-21en_US
dc.identifier.govdocH01L023/34zh_TW
dc.identifier.govdocH01L023/538zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/128810-
dc.description.abstract一種三維積體電路，包括：一第一接合層，具有彼此對向的一第一表面與一第二表面；一第一晶片，配置於該第一接合層的該第一表面，該第一晶片包括一熱源區；一第二晶片，配置於該第一接合層的該第二表面；以及一層間散熱片，埋設於第一接合層內，並正對於該熱源區。zh_TW
dc.language.isozh_TWen_US
dc.title三維積體電路zh_TW
dc.typePatentsen_US
dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI509758zh_TW
Appears in Collections:Patents


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