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dc.contributor.authorChiang, KCen_US
dc.contributor.authorLai, CHen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorWang, TJen_US
dc.contributor.authorChiu, HFen_US
dc.contributor.authorChen, JRen_US
dc.contributor.authorMcAlister, SPen_US
dc.contributor.authorChi, CCen_US
dc.date.accessioned2014-12-08T15:18:20Z-
dc.date.available2014-12-08T15:18:20Z-
dc.date.issued2005-10-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2005.856708en_US
dc.identifier.urihttp://hdl.handle.net/11536/13216-
dc.description.abstractA very high density of 23 fF/mu m(2) has been measured in RF metal-insulator-metal (MIM) capacitors which use high-kappa TaTiO as the dielectric. In addition, the devices show a small reduction of 1.8% in the capacitance, from 100 kHz to 10 GHz. Together with these characteristics the MIM capacitors show low leakage currents and a small voltage-dependence of capacitance at 1 GHz. These TaTiO MINI capacitors should be useful for precision RF circuits.en_US
dc.language.isoen_USen_US
dc.subjectcapacitoren_US
dc.subjectRF metal-insulator-metal (MIM)en_US
dc.subjectTaTiOen_US
dc.titleVery high-density (23 fF/mu m(2)) RF MIM capacitors using high-k TaTiO as the dielectricen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2005.856708en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume26en_US
dc.citation.issue10en_US
dc.citation.spage728en_US
dc.citation.epage730en_US
dc.contributor.department奈米科技中心zh_TW
dc.contributor.departmentCenter for Nanoscience and Technologyen_US
dc.identifier.wosnumberWOS:000232208700010-
dc.citation.woscount61-
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