完整後設資料紀錄
DC 欄位語言
dc.contributor.authorDai, Chia-Tsenen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2017-04-21T06:56:35Z-
dc.date.available2017-04-21T06:56:35Z-
dc.date.issued2016-06en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2016.2549598en_US
dc.identifier.urihttp://hdl.handle.net/11536/133947-
dc.description.abstractThe optimization of guard ring structures to improve latchup immunity in an 18 V double-diffused drain MOS (DDDMOS) process with the DDDMOS transistors has together been investigated in a silicon test chip. The layout parameters including the anode-to-cathode spacing and the guard ring width are also studied to seek their impacts on latchup immunity. The measurement results demonstrated that the test devices isolated with the specific guard ring structure of n-buried layer can highly improve the latchup immunity. The suggested guard ring structures can be applied to the high-voltage circuits in this 18 V DDDMOS process to meet the new Joint Electron Device Engineering Council standard (JESD78D) with the trigger current of over +/- 200 mA.en_US
dc.language.isoen_USen_US
dc.subjectDouble-diffused drain (DDD)en_US
dc.subjectlatchupen_US
dc.subjectn-buried layer (NBL)en_US
dc.titleOptimization of Guard Ring Structures to Improve Latchup Immunity in an 18 V DDDMOS Processen_US
dc.identifier.doi10.1109/TED.2016.2549598en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume63en_US
dc.citation.issue6en_US
dc.citation.spage2449en_US
dc.citation.epage2454en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000378592800034en_US
顯示於類別:期刊論文