標題: Fabrication and Reliability Investigation of Copper Pillar and Tapered Through Silicon Via (TSV) for Direct Bonding in 3D Integration
作者: Chang, Yu-Wei
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2015
摘要: Compare to the conventional structure, in this research, the structure of Cu pillar and tapered TSV for direct bonding has an excellent potential for low bonding temperature within a short bonding time. In addition, this scheme has the advantage of self-alignment ability. This paper focuses on the fabrication of taper-shape of through silicon via (TSV) and reports the quality and reliability investigation of bonding results.
URI: http://hdl.handle.net/11536/136113
ISBN: 978-1-4799-9928-6
ISSN: 1946-1550
期刊: PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015)
起始頁: 439
結束頁: 442
顯示於類別:會議論文