標題: | Fabrication and Reliability Investigation of Copper Pillar and Tapered Through Silicon Via (TSV) for Direct Bonding in 3D Integration |
作者: | Chang, Yu-Wei Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 2015 |
摘要: | Compare to the conventional structure, in this research, the structure of Cu pillar and tapered TSV for direct bonding has an excellent potential for low bonding temperature within a short bonding time. In addition, this scheme has the advantage of self-alignment ability. This paper focuses on the fabrication of taper-shape of through silicon via (TSV) and reports the quality and reliability investigation of bonding results. |
URI: | http://hdl.handle.net/11536/136113 |
ISBN: | 978-1-4799-9928-6 |
ISSN: | 1946-1550 |
期刊: | PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015) |
起始頁: | 439 |
結束頁: | 442 |
顯示於類別: | 會議論文 |