標題: Feasible Assignment of Micro-Bumps in 3D ICs
作者: Yan, Jin-Tai
Yen, Chia-Heng
生物資訊及系統生物研究所
Institude of Bioinformatics and Systems Biology
公開日期: 1-Jan-2018
摘要: For the signal connections between two adjacent dies in 3D ICs, the redistributed layers (RDLs) routing from 10 pads to micro-humps plays an important role. In this paper, given a set of nets on the upper and lower RDLs between two adjacent dies, based on the separation of one 2-pin net on the upper and lower RDLs using one micro-hump, an efficient two-phase algorithm can he proposed to assign feasible micro bumps onto the nets to minimize the overlapping degree and the X-type intersections on the routing regions for single-layer RDI, routing. Compared with Kuan's algorithm and Yan's algorithm in the micro-hump assignment for single-layer RBI, routing, the experimental results show that our proposed algorithm can use less CPU time to assign feasible micro humps onto the given nets and obtain 100% routability with shorter wirelength in 5 tested examples.
URI: http://hdl.handle.net/11536/151047
ISSN: 2472-467X
期刊: 2018 16TH IEEE INTERNATIONAL NEW CIRCUITS AND SYSTEMS CONFERENCE (NEWCAS)
起始頁: 296
結束頁: 299
Appears in Collections:Conferences Paper