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dc.contributor.authorChen, Chun-Chengen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2019-08-02T02:14:47Z-
dc.date.available2019-08-02T02:14:47Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-1-5386-9504-3en_US
dc.identifier.issn1541-7026en_US
dc.identifier.urihttp://hdl.handle.net/11536/152120-
dc.description.abstractThis work studied the latch-up path between two PMOS devices powered by different supply voltages in a 0.18- m CMOS process. In IC field applications, such a non-typical latch up path between two PMOS devices was ever fired to cause unrecoverable failures. Through the silicon test chip, the latch-up path between I/O PMOS and core PMOS was investigated in details. The measurement results from the silicon chip with split test structures can be used to investigate the design rules on anode-to-cathode spacing and guard ring placement to prevent such PMOS-to-PMOS latch-up issue. In chip layout of IC products, the PMOS devices in different power domains shall be carefully checked to prevent the occurrence of such unexpected latch-up path.en_US
dc.language.isoen_USen_US
dc.subjectlatch-upen_US
dc.subjectguard ringen_US
dc.subjectdesign ruleen_US
dc.subjectholding voltageen_US
dc.titleInvestigation on Latch-Up Path between I/O PMOS and Core PMOS in a 0.18-mu m CMOS Processen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2019 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000474762500126en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper