標題: PROCESS DEVELOPMENT OF LOW RESISTIVE Ag-BASED THROUGH SILICON VIAS USING INKJET PRINTING TECHNIQUE FOR 3D MICROSYSTEM INTEGRATION
作者: Yang, Jia-Han
Tsou, Kun-Lin
Fu, Yu-Min
Cheng, Yu-Ting
Song, Yen-Fang
加速器光源科技與應用學位學程
電子工程學系及電子研究所
Master and Ph.D. Program for Science and Technology of Accelrrator Light Source
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Jan-2019
摘要: This paper presents an inkjet printing and filling process to produce 250 mu m deep Ag-based fully filled through silicon vias with the aspect ratio of via depth vs. diameter up to 5. With the optimization of the printing pattern, humidity control, and silver mirror reaction, the Ag TSV subjected to 400 degrees C thermal anneal for 60 mins can exhibit a resistivity of 26 mu Omega.cm, the lowest resistivity and highest AR ever reported. Process simplicity and no need of metal liners make the technique with great potential for 3D microsystem integration.
URI: http://hdl.handle.net/11536/155020
ISBN: 978-1-7281-1610-5
ISSN: 1084-6999
期刊: 2019 IEEE 32ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)
起始頁: 376
結束頁: 379
Appears in Collections:Conferences Paper