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dc.contributor.authorChen, CCen_US
dc.contributor.authorHung, BFen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorMcAlister, SPen_US
dc.date.accessioned2014-12-08T15:37:26Z-
dc.date.available2014-12-08T15:37:26Z-
dc.date.issued2004-10-20en_US
dc.identifier.issn0895-2477en_US
dc.identifier.urihttp://dx.doi.org/10.1002/mop.20404en_US
dc.identifier.urihttp://hdl.handle.net/11536/25746-
dc.description.abstractMicrostrip transmission lines with very low power loss of 0.4 dB/mm at 50 GHz have been fabricated on Si substrates using an optimized ion-implantation process. These devices have the inherent advantages of smaller chip Size and better power performance than CPW lines. Using the same approach, high-performance thin-film microstrip lines are also developed, showing a loss of 0.9 dB/mm at 20 GHz. This approach is compatible with existing VLSI backend layout technology. (C) 2004 Wiley Periodicals, Inc.en_US
dc.language.isoen_USen_US
dc.subjectmicrostrip linesen_US
dc.subjectSien_US
dc.subjection implantationen_US
dc.subjectCPWen_US
dc.subjectthin-filmen_US
dc.subjectVLSIen_US
dc.titleHigh-performance bulk and thin-film microstrip transmission lines on VLSI-standard Si substratesen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/mop.20404en_US
dc.identifier.journalMICROWAVE AND OPTICAL TECHNOLOGY LETTERSen_US
dc.citation.volume43en_US
dc.citation.issue2en_US
dc.citation.spage148en_US
dc.citation.epage151en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000223815300020-
dc.citation.woscount2-
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