完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chen, CC | en_US |
dc.contributor.author | Hung, BF | en_US |
dc.contributor.author | Chin, A | en_US |
dc.contributor.author | McAlister, SP | en_US |
dc.date.accessioned | 2014-12-08T15:37:26Z | - |
dc.date.available | 2014-12-08T15:37:26Z | - |
dc.date.issued | 2004-10-20 | en_US |
dc.identifier.issn | 0895-2477 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1002/mop.20404 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/25746 | - |
dc.description.abstract | Microstrip transmission lines with very low power loss of 0.4 dB/mm at 50 GHz have been fabricated on Si substrates using an optimized ion-implantation process. These devices have the inherent advantages of smaller chip Size and better power performance than CPW lines. Using the same approach, high-performance thin-film microstrip lines are also developed, showing a loss of 0.9 dB/mm at 20 GHz. This approach is compatible with existing VLSI backend layout technology. (C) 2004 Wiley Periodicals, Inc. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | microstrip lines | en_US |
dc.subject | Si | en_US |
dc.subject | ion implantation | en_US |
dc.subject | CPW | en_US |
dc.subject | thin-film | en_US |
dc.subject | VLSI | en_US |
dc.title | High-performance bulk and thin-film microstrip transmission lines on VLSI-standard Si substrates | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1002/mop.20404 | en_US |
dc.identifier.journal | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | en_US |
dc.citation.volume | 43 | en_US |
dc.citation.issue | 2 | en_US |
dc.citation.spage | 148 | en_US |
dc.citation.epage | 151 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000223815300020 | - |
dc.citation.woscount | 2 | - |
顯示於類別: | 期刊論文 |