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dc.contributor.authorLue, HTen_US
dc.contributor.authorTseng, TYen_US
dc.contributor.authorHuang, GWen_US
dc.date.accessioned2014-12-08T15:42:30Z-
dc.date.available2014-12-08T15:42:30Z-
dc.date.issued2002-04-15en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.1459603en_US
dc.identifier.urihttp://hdl.handle.net/11536/28859-
dc.description.abstractWe have developed a method to investigate the dielectric and interfacial properties of gate dielectric thin films by microwave measurement. Ba0.5Sr0.5TiO3 (BST) thin films were deposited on 10 Omega cm (normal) and 10 k Omega cm [high-resistivity, (HR)] silicon substrates at the same time by rf magnetron sputtering. For the BST/HR-silicon, coplanar waveguides (CPW) were fabricated and measured at microwave frequencies with thru-reflect-line calibration while capacitance (C-V) measurements were carried out for BST/normal silicon. From the phase change of CPW transmission line and the maximum capacitance in C-V measurement, the dielectric constants of both the BST thin film and interface layer can be determined. Furthermore, the behaviors of insertion loss versus bias voltage were investigated. The results indicate that our method can provide useful information to study the dielectric and interfacial properties of metal-insulator-semiconductor structures. (C) 2002 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleA method to characterize the dielectric and interfacial properties of metal-insulator-semiconductor structures by microwave measurementen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.1459603en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume91en_US
dc.citation.issue8en_US
dc.citation.spage5275en_US
dc.citation.epage5282en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000174666600080-
dc.citation.woscount23-
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