標題: Evaluation of plasma charging damage in ultrathin gate oxides
作者: Lin, HC
Chen, CC
Chien, CH
Hsein, SK
Wang, MF
Chao, TS
Huang, TY
Chang, CY
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: dielectric breakdown;plasma materials-processing applications;semiconductor device reliability
公開日期: 1-Mar-1998
摘要: Monitoring of plasma charging damage in ultrathin oxides (e.g., <4 nm) is essential to understand its impact on device reliability. However, it is observed that the shift of several device parameters, including threshold voltage, transconductance, and subthreshold swing, are not sensitive to plasma charging and thus not suitable for this purpose. Consequently, some destructive methods, such as the charge-to-breakdown measurement, are necessary to evaluate plasma damage in the ultrathin oxides.
URI: http://dx.doi.org/10.1109/55.661167
http://hdl.handle.net/11536/32760
ISSN: 0741-3106
DOI: 10.1109/55.661167
期刊: IEEE ELECTRON DEVICE LETTERS
Volume: 19
Issue: 3
起始頁: 68
結束頁: 70
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