標題: | Evaluation of plasma charging damage in ultrathin gate oxides |
作者: | Lin, HC Chen, CC Chien, CH Hsein, SK Wang, MF Chao, TS Huang, TY Chang, CY 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | dielectric breakdown;plasma materials-processing applications;semiconductor device reliability |
公開日期: | 1-Mar-1998 |
摘要: | Monitoring of plasma charging damage in ultrathin oxides (e.g., <4 nm) is essential to understand its impact on device reliability. However, it is observed that the shift of several device parameters, including threshold voltage, transconductance, and subthreshold swing, are not sensitive to plasma charging and thus not suitable for this purpose. Consequently, some destructive methods, such as the charge-to-breakdown measurement, are necessary to evaluate plasma damage in the ultrathin oxides. |
URI: | http://dx.doi.org/10.1109/55.661167 http://hdl.handle.net/11536/32760 |
ISSN: | 0741-3106 |
DOI: | 10.1109/55.661167 |
期刊: | IEEE ELECTRON DEVICE LETTERS |
Volume: | 19 |
Issue: | 3 |
起始頁: | 68 |
結束頁: | 70 |
Appears in Collections: | Articles |
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