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dc.contributor.authorChen, Shih-Changen_US
dc.contributor.authorChen, Yung-Yuen_US
dc.contributor.authorChang, Yu-Tzuen_US
dc.contributor.authorLou, Jen-Chungen_US
dc.contributor.authorKin, Kon-Tsuen_US
dc.contributor.authorChien, Chao-Hsinen_US
dc.date.accessioned2014-12-08T15:05:33Z-
dc.date.available2014-12-08T15:05:33Z-
dc.date.issued2007-09-01en_US
dc.identifier.issn0167-9317en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.mee.2007.04.127en_US
dc.identifier.urihttp://hdl.handle.net/11536/4096-
dc.description.abstractIn this study, we improved the interfacial properties of high-kappa gate stacks with the surface treatment of ozonated water prior to deposition of hafnium oxide (HfO2). We demonstrated that the Ozone-oxide improved the electrical properties of the HfO2 gate stack interface in terms of its smoother interface, lower leakage current density, narrower hysteresis width, superior charge trapping effect, and reliability. From these experimental results, we believe that treatment with ozone is an efficient method for the preparation of high-quality interfaces between HfO2 and silicon surfaces.en_US
dc.language.isoen_USen_US
dc.subjecthigh-kappaen_US
dc.subjectozoneen_US
dc.subjectsurface treatmenten_US
dc.subjectcharge trappingen_US
dc.subjectreliabilityen_US
dc.titleImprovements of ozone surface treatment on the electrical characteristics and reliability in HfO2 gate stacksen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.mee.2007.04.127en_US
dc.identifier.journalMICROELECTRONIC ENGINEERINGen_US
dc.citation.volume84en_US
dc.citation.issue9-10en_US
dc.citation.spage1898en_US
dc.citation.epage1901en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000247378600014-
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