标题: | 适用于高能源效率晶片之可感知变异超低电压设计 Variation-Aware Ultra-Low Voltage Design for Energy Efficient Chips |
作者: | 张铭宏 Chang, Ming-Hung 黄威 Hwang, Wei 电子研究所 |
关键字: | 可感知变异;超低电压;静态记忆体;同面积分析;先进先出记忆体;Variation-Aware;Ultra-Low Voltage;SRAM;ISO-Area Analysis;FIFO Memory |
公开日期: | 2011 |
摘要: | 本论文提出一具备高能源效率设计之动态电压频率调整平台。高能源效率设计包括超低电压温度感测器、可感知变异之频率产生器、高可靠度之超低电压静态记忆体与先进先出记忆体。以上述先进先出记忆体作为验证电路,实现一个高稳定性的动态电压频率系统设计。 超低电压全晶上频率基底之温度感测器可工作于0.4V与0˚C~100˚C温度范围内,每秒可有效侦测45k次,使用一位元校正机制下,仅有-1.81˚C~+1.52˚C的温度误差,其实现于TSMC 65nm制程下,使用面积为990μm2。Logical effort是数位设计者常用之技巧,但传统的Logical effort并未考虑CMOS操作于不同工作区间,以及温度和制程对其造成的影响,本论文提出一个可应用在0.1V~1V间的统一Logical effort,并且可减少温度和制程变化所造成的延迟估计误差。根据上述的统一Logical effort,本论文设计一超低电压频率产生器,其内建的感测器可提供资讯动态自我调整锁定区间误差,此技术实现于UMC 65nm制程下,可产生625kHz及5MHz最高频率输出分别在0.2V与0.5V下,且其消耗的功率仅各有0.18μW与5.17μW,同时本频率产生器可合成出1/8至4倍于参考频率之输出。 本论文设计一运用打断正回授正反器回圈以改善写入能力之9T静态记忆体,本记忆体同时具备读取缓冲以增进写入可靠度与降低漏电电流,位元交错结构也可与本静态记忆体交错运用以提高软错误的抵抗能力,本静态记忆体实现于UMC 65nm制程下,可工作于电压为0.3V以909kHz频率操作且仅消耗最低能源3.51μW。为提供无线近身网路系统良好的储存单元,本论文设计一以10T静态记忆体基底之先进先出记忆体,该先进先出记忆体实现于UMC 90nm制程下,可工作于电压为0.4V以50kHz频率操作写入仅消耗最低能源2.09μW,同时以625kHz频率操作读取仅消耗最低能源2.25μW。 本论文提供一具备高能源效率设计之动态电压频率调整平台,以8T静态记忆体基底之先进先出记忆体作为展示电路,提供两种工作模式:低电压(0.3V)与高效能(0.5V),若其持续工作于低电压模式时可节省69.5%功率消耗,本平台可适用于高稳定性之无线近身网路应用。 Energy efficient design is a key focus in emerging energy-constrained platforms. Dynamic voltage frequency scaling (DVFS) platform with energy-efficient designs are presented in this thesis. Ultra-low voltage temperature sensor and variation-aware clock generator are implemented to enable DVFS platform. Robust near-/sub-threshold SRAM/FIFO memories are designed as the test vehicle of DVFS platform. An ultra-low voltage fully integrated frequency-domain smart temperature sensor is presented. With one-point calibration, a -1.81˚C~ +1.52˚C inaccuracy over a 0˚C~100˚C temperature operation range has been measured for 12 test chips. At a conversion rate of 45k samples/s, the proposed temperature sensor consumes an average power of 520nW and achieves 0.49˚C/LSB at 11-bit output resolution. It occupies only 990μm2 in a TSMC 65-nm general purpose bulk CMOS process. The voltage-/temperature-induced delay estimation error of conventional logical effort is much more severe in near-/sub-threshold region. Super-/near-/sub-threshold logical effort models are presented to eliminate delay estimation error caused by voltage and temperature variations. A near-/sub-threshold programmable clock generator is also presented in this thesis. The major challenge of the ultra-low voltage (ULV) circuits is that the lock-in range of the delay line is easily affected by the environmental variations. In the proposed clock generator, there is a PVT compensation unit which consists of a set of delay line and a PVT detector. The unit is responsible for adjusting the lock-in range of clock generator to guarantee successful clock lock. In addition, it has the ability to generate the output clock with frequency from 1/8 to 4 times of the reference clock. The clock generator has been designed using UMC 65nm CMOS technology. The frequencies of reference clock are 625 KHz at 0.2V and 5MHz at 0.5V. The power consumptions are 0.18μW and 5.17μW, respectively, at 0.2V and 0.5V. The core area of this clock generator is 0.01mm2. A 9T SRAM bit-cell is presented to enhance write ability by cutting off the positive feedback loop of SRAM cross-coupled inverter pair. In read mode, an access buffer is designed to isolate storage node from read path for better read robustness and leakage reduction. Bit-interleaving scheme is allowed by incorporating the proposed 9T SRAM bit-cell with additional write-wordlines (WWL/WWLb) for soft error tolerance. A 1Kbit 9T 4-to-1 bit-interleaved SRAM is implemented in 65nm bulk CMOS technology. The experimental results demonstrate that the test chip minimum energy point occurs at 0.3V supply voltage. It can achieve an operation frequency of 909kHz with 3.51μW active power consumption. An ultra-low power (ULP) 16Kbit SRAM-based first-in first-out (FIFO) memory is also presented for wireless body area networks (WBANs). The proposed FIFO memory is capable of operating in ultra-low voltage (ULV) regime with high variation immunity. An ULP near-/sub-threshold 10 transistors (10T) SRAM bit-cell is proposed to be the storage element for improving write variation in ULV regime and eliminate the data-dependent bit-line leakage. The proposed SRAM-based FIFO memory also features adaptive power control circuit, counter-based pointers, and a smart replica read/write control unit. The proposed FIFO is implemented to achieve a minimum operating voltage of 400mV in UMC 90nm CMOS technology. The write power is 2.09μW at 50kHz and the read power is 2.25μW at 625kHz. Finally, a 512-word by 16-bit (8kb) subthreshold asynchronous first-in first-out (FIFO) memory is presented for wireless body area networks (WBANs). Meanwhile, A 1kb dynamic voltage scaling 8T SRAM-based FIFO memory is implemented to operate between 0.5V (near-threshold) and 0.3V (subthreshold) in UMC 65nm technology with 0.535μW at 625kHz and 0.163μW at 20kHz power consumption, respectively. The proposed DVS FIFO memory can provide up to 69.5% power savings when low-power mode is always engaged, and there is no power overhead if the period of low-power mode is longer than 48.66μs. It is suitable for healthcare applications equipped with DVFS capability. |
URI: | http://140.113.39.130/cdrfb3/record/nctu/#GT079511824 http://hdl.handle.net/11536/41061 |
显示于类别: | Thesis |
文件中的档案:
If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.