THE EFFECTS OF THERMAL SILICIDATION ON THE CURRENT TRANSPORT CHARACTERISTICS OF TI/(111)SI SCHOTTKY-BARRIER CONTACTS

标题:	THE EFFECTS OF THERMAL SILICIDATION ON THE CURRENT TRANSPORT CHARACTERISTICS OF TI/(111)SI SCHOTTKY-BARRIER CONTACTS
作者:	TSENG, HH WU, CY 交大名义发表工学院 National Chiao Tung University College of Engineering
公开日期:	1-一月-1988
URI:	http://hdl.handle.net/11536/4578
ISSN:	0038-1101
期刊:	SOLID-STATE ELECTRONICS
Volume:	31
Issue:	1
起始页:	35
结束页:	44
显示于类别：	Articles

APA	TSENG, H., & WU, C. (1988). THE EFFECTS OF THERMAL SILICIDATION ON THE CURRENT TRANSPORT CHARACTERISTICS OF TI/(111)SI SCHOTTKY-BARRIER CONTACTS. WOS:A1988L593300006.
Bibtex	@article{TSENG1988THE, title={THE EFFECTS OF THERMAL SILICIDATION ON THE CURRENT TRANSPORT CHARACTERISTICS OF TI/(111)SI SCHOTTKY-BARRIER CONTACTS}, author={TSENG, HH and WU, CY}, journal={WOS:A1988L593300006}, year={1988}, url={https://ir.lib.nycu.edu.tw/handle/11536/4578?locale=zh_CN}, }