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dc.contributor.author古登傑en_US
dc.contributor.authorKu, Teng-Chiehen_US
dc.contributor.author荊鳳德en_US
dc.date.accessioned2014-12-12T01:55:33Z-
dc.date.available2014-12-12T01:55:33Z-
dc.date.issued2011en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT079911687en_US
dc.identifier.urihttp://hdl.handle.net/11536/49201-
dc.description.abstract蕭特基金氧半電晶體可以克服源汲極寄生電阻效應,因其金屬與半導體接面的 低電阻。當蕭特基金氧半電晶體使用金屬閘極-高介電係數介電層的結構,它可 避免離子佈值後的高溫退火製程,也可避免對金屬閘極-高介電係數介電層的高 溫退火。在本篇論文中,會示範用簡單的低溫製程去製作出蕭特基金氧半電晶體,此元件是使用金屬矽化鉑為所需的源、汲極,整個製程的最高溫度為400度。zh_TW
dc.description.abstractThe Schottky barrier source/drain transistor (SSDT) has been proposed to overcome the series resistance problem of ultrashallow S/D junction of sub50–nm MOSFETs, due to the abrupt silicide/Si interface and low sheet resistance of silicide. SSDT is particularly attractive when a metal-gate/high-k gate stack is employed, as it avoids the use of a high-temperature annealing process required for implanted S/D junctions and poly gate, hence, eliminating the thermal stability issues associated with high-k gate stack. In this dissertation, p-channel SSDTs with PtSi S/Ds are demonstrated using a simplified low-temperature process. The highest temperature in the entire fabrication process was 400 oC .en_US
dc.language.isoen_USen_US
dc.subject蕭特基zh_TW
dc.subjectSchottkyen_US
dc.title矽化鉑蕭特基金氧半電晶體使用高介電係數介電層與金屬閘極zh_TW
dc.titleSchottky Barrier Source/Drain MOSFET Using Platinum Silicide With High-K Gate Dielectric and Metal-Gate Electrodeen_US
dc.typeThesisen_US
dc.contributor.department電子研究所zh_TW
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