半導體工廠派工問題之探討

Abstract

半導體工廠生產晶圓的製程非常繁雜，除了要求高級的製造技術外，速必須重複經過某些程序許多次，造成晶圓的生產方式形成不易掌握的迴圈製造模式。在面臨市場上多種少量的訂單壓力以及快速交貨的客戶要求下，半導體工廠內很自然的選擇以提高在製品存貨來應付。但是當在製品存貨的數量達到每個月產出量的一至二倍，甚至更高時，許多問題開始出現，必須對其生產行為加以改善。由於影饗半導體生產的因素多變，規劃出一套細部排程不一定對半導體的生產有實質上的功效，所以發展出一套既可得滿足客戶需求又可降低製品存貨及縮短生產週期同時也能使現場人員能有效遵循的派工法則，可能是較實用的作法。 本研究將套用一些典型的派工法則，庶用於此半導後生產的模式中，探討其效果。然後，建立一特別為半導體發展的派工法則應用於生產的模式中。並希望能獲得更佳的系統表現。

Wafer fabrication is one of the most complex manufacturing process in discrete industry. Its operation loop characteristics and 200 to 300 operations let that pre-plan production schedule for every order and every machine is impossible. Even possible, rescheduling wiil be very frequently due to the fast production enviroment change. Therefore reactive scheduling (use different dispatching rules) to solve wafer fabrication scheduling problem will be a suitable approach. In this thesis, five implemental dispatching rules and one new dispatching rules are studied. A computer-factory based on a local semoconductor company is built to test and evaluate these dispatching rules. Finally, suggestions and implemental approaches are made for these dispatching rules.