新型熱導式加速計之製作

Abstract

本論文主旨在探討新型熱導式加速計.利用與傳統加速計不同的 量測概念--熱傳導-感測加速度值.對此元件感測原理分析並計算加速靈敏 度.用ANSYS軟體模擬元件機械特性,以ELECTRO-THERMAL SPICE 模擬元件 電訊響應.運用特殊之(111)異方蝕刻矽微加工技術,製作狹縫隙浮板結構, 並做白金(Pt)感測元,及以黃金(Au)為重錘,製作熱導式微加速計.對量測 結果加以探討分析.最終以本次經驗對熱導式微加速計作最佳化設計,並以 此展望未來. The major key issue of this article is focused on anew accelerometer.By using a novel idea different from the conventional accelerometer - thermalconduction,we can detect the acceleration of the device. To analyze the behav-ior of this accelerometer, a lumped ELECTRO-THERMAL SPICE model is developed to calculate the sensitivity of the acceleration and mechanic properties ofthis device are simulated by ANSYS software. Based on Si(111) anisotropic etch-ing technique of micromaching, we can fabricate a floating membrane of a shallowgap with Pt metal lines sensing the change of temperature and thick Au film isdeposited on the front of the membrane. Under careful and hard work, this newaccelerometer is born. The measured results are fully analyzed and discussed.Finally, from this research, an optimizatin design of a thermal micro-accelero-meter is proposed for future work.