軟性印刷電路板應用趨勢與品質管理策略-以F公司為例

Abstract

現今微處理器的運算越做越精細功能也越強，讓3C可攜式電子產品的功能更多元，所需搭載的電子零件與溝通線路使電路板越來越厚，但可攜式電子產品輕薄短小的趨勢已不可免，所以軟式電路板的需求除了超越硬式電路板的應用，更薄的軟式電路板(FPC) ，不斷須提升技術能力，以讓可攜式產品的應用更加輕便精緻。手機的厚度從2011年的8.4mm到7.9mm，平板電腦也從2011年的11.4mm到7.7mm的輕薄境界，展望未來更輕薄的產品也會競爭更加激烈，軟性電路板的扮演腳色之重要可見一斑。 本文研究之公司在軟式電路板已深耕多年，現有主力產品為單層、雙層，以及多層軟式電路板，其製程技術也與產品應用以及3C產品大廠共同成長，厚度從150微米到50微米，線路與線距的精密度也從50微米即將踏入30微米的超細線路，線路設計的複雜性也隨著結構的更迭越趨細密，阻抗/電性以及電路板可繞性也不斷再拉高，這也造成製造技術的瓶頸以及品質管制的困難性，由於軟性電路板的製作需防止高不良報廢以及信賴性的高標準，在品質計畫與品質保證系統的要求必須完整做到早期發現早期防止，也就是領先管理。 本研究主要是解構目前的軟性電路板應用發展趨勢，同時使用SWOT分析其採用不同的品質管理策略，會帶來什麼效果。在SPC系統，shop-flow系統以及統計分析品管，進行差異化分析優劣，再以品保系統的組織架構分析模式，進而達到改善良率的目的。利用組織可行方案中決策元素評估，新產品量產品的改善，提供更佳的品質策略，加入實戰結果，幫助決策者做為評估與判斷的依據。為本研究公司找到一個最佳的品質管理策略。

Now a day, the operation of processor is more delicate and powerful in function, this help to be with various functions for 3C mobile devices. The electric component and circuit make FPC more thicker, but the trend of slight and thin is avoidable, so FPC application surpass the PCB use, meanwhile the thinner FPC has promoted its requirement for technology, this is necessary for mobile devices. The thickness of mobile move to 7.95mm in 2011 from 8.48 mm, for tablet PC, it gets to 7.7 mm form 11.4 mm in 2011, foresee the future product, the competition would be more intensely. The play role of FPC will be important in these roles. The study case, F company, it pay technical effort in this field for twenty years, currently its main product include single, double, and triple layers, this company grows up with 3C company in terms of technical and application of mobile devices. Technical thickness has been limited to 50 um form 150 um, line width and space also step onto 30 um from 50 um, the complication of line design go to more fine with the change of structure, the impedance, electricity and flexibility of FPC leverage to higher position, too. Meanwhile, these bottle necks of manufacture technical will make many difficulties in quality control. Due to the high end criteria of reliability and prevention of huge scrap in FPC manufacture, it needs to reach early detect and early results to fulfill the requirement of quality control plan and system. Also say it leading management. The study purpose is to analyze the trends of FPC application and its development, at the same time, by using SWOT metrology to understand what effects when apply different quality strategy. To do differentiate analysis by SPC system and shop-flow system is required. Additionally helps to reach the target of yield improvement by analysis model of quality assurance organization structure. We could use the element of make-decision model in feasible cases of organization. The improvement of new product introduce and mass production, will provide more better and appropriate quality control strategy, by adding the result of actual combat. These helps to decision maker to evaluate and judge what quality strategy fit to F Company.