標題: | Selective Device Structure Scaling and Parasitics Engineering: A Way to Extend the Technology Roadmap |
作者: | Wei, Lan Deng, Jie Chang, Li-Wen Kim, Keunwoo Chuang, Ching-Te Wong, H. -S. Philip 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | CMOS;contacted gate pitch;device geometry;device scaling;footprint;parasitic |
公開日期: | 1-Feb-2009 |
摘要: | We propose a path for extending the technology roadmap when currently considered technology boosters (e.g., strain, high-kappa/metal gate) reach their limits and physical gate length can no longer be effectively scaled down. By judiciously engineering the device parasitic resistance and parasitic capacitance, and considering the impact of the interconnect wiring capacitance, we propose scenarios of selective device structure scaling that will enable technology scaling and contacted gate pitch scaling for several generations beyond the currently perceived limits. |
URI: | http://dx.doi.org/10.1109/TED.2008.2010573 http://hdl.handle.net/11536/7663 |
ISSN: | 0018-9383 |
DOI: | 10.1109/TED.2008.2010573 |
期刊: | IEEE TRANSACTIONS ON ELECTRON DEVICES |
Volume: | 56 |
Issue: | 2 |
起始頁: | 312 |
結束頁: | 320 |
Appears in Collections: | Articles |
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