半導體測試用高效能傳導元件之設計與製作

Abstract

本論文研製之電傳導界面元件(Contactor)，經證實可以利用高週波爐建立熔煉完成金基合金電接觸材料的技術。本研究之金基合金電接觸材料是以，金-銅-鉑-銀四元合金系統為主分別搭配，鋅(Zn)及鎳(Ni)等之強化相材料，其目的在於強化機械性質並保持高導電性。目前普遍被使用之電接觸材料為銅(Cu)基合金材料，此材料在測試環境溫度達100℃時表面易生成黑色氧化銅膜，測試環境溫度高於300℃時易生成紅色氧化亞銅膜，接觸電阻增加，嚴重時易導致接觸點燒熔。金(Au)俱有良好之抗蝕性、延展性、高導電率、不易氧化等優異特性，只要能提高其硬度並保持高導電性，便能拓展電接觸材料之應用尤其在高頻、高效能之半導體IC元件。 本研究重點係針對金基合金材料的製程控制，強化相材料之選擇與強化基礎，熱處理條件、程序為主要控制參數，探討合金組織結構及其機械性質與電性上之變化依據實際量測結果與分析，獲得最佳化之製程參數，實驗結果顯示在適當製程條件下，硬度可達377Hv，電阻係數15.68μΩ.cm，達到實用之標準。

The purpose of this theses for develop gold matrix composites for electrical contact alloy with high strength and high electrical conductivity. Experimental results reveal that we can use the transistor induction heating machine manufacturing gold electrical contact alloy. Widespread the electrical contact alloy been used currently get in touch with the material as the copper(Cu) alloy material, this material the surface is easily born a oxidize copper film, get in touch with electric resistance to increase, that will cause the contact burn out easily. The gold (Au) has good anti-eclipse, ductility, high conductivity and stability, as long as can enhance its hardness and keep high electrical conductivity, can expand gold electrical contact's application. This research point is the manufacturing process control which aims at enhancing material and enhancing foundation, processing condition, procedure is main control parameters, Experimental results show at under appropriate manufacturing process condition, the hardness can reach to 377Hv, the electric resistance coefficient can reach to 15.68 μΩ.cm, reach practical standard.