| 標題: | 12吋矽晶圓半導體CVD製程設備及BST介電薄膜成長研究---子計畫II：BST介電薄膜在12吋矽晶圓上快速熱回火製程中熱物理性質及熱應力之研究(I) Study on the Thermal Properties and Stresses of a 12-Inch Silicon Wafer with High-Dielectric BST Thin Films in Rapid Thermal Processing/Annealing (I) |
| 作者: | 曲新生 CHU, HSIN-SEN 交通大學機械工程系 |
| 關鍵字: | BST介電薄膜;熱物理性質;快速熱回火製程;熱應力;BST dielectric thin film;Thermal physical property;Rapid thermal processing (RTP);Thermal stress |
| 公開日期: | 2000 |
| 官方說明文件#: | NSC89-2212-E009-039 |
| URI: | http://hdl.handle.net/11536/91574 https://www.grb.gov.tw/search/planDetail?id=501218&docId=90364 |
| Appears in Collections: | Research Plans |
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