| 標題: | 用於寬頻通信之高性能單一載具整合晶片系統---子計畫II：應用系統構裝技術之多頻射頻前端積體電路(I) Multi-Band RF Front-End Integrated Circuits in System-on-Package Technology (I) |
| 作者: | 郭建男 KUO CHIEN-NAN 國立交通大學電子工程學系 |
| 公開日期: | 2003 |
| 官方說明文件#: | NSC92-2220-E009-007 |
| URI: | http://hdl.handle.net/11536/92084 https://www.grb.gov.tw/search/planDetail?id=844260&docId=159993 |
| Appears in Collections: | Research Plans |
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